Effect of Different Nickel Percentage in Solder Alloy towards Intermetallic Compound Formation and Growth
نویسندگان
چکیده
منابع مشابه
Copper/solder intermetallic growth studies.
Copper samples, hot solder (eutectic) dipped and thermally aged, were cross-sectioned and placed in an environmental scanning electronic microscope (ESEM). While in the ESEM the samples were heated for approximately 2.5 h at 170 degrees C to stimulate the growth of additional Cu/Sn intermetallic compound. The intent of the study was to obtain a continuous real-time videotape record of the diffu...
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ژورنال
عنوان ژورنال: IOP Conference Series: Materials Science and Engineering
سال: 2021
ISSN: 1757-8981,1757-899X
DOI: 10.1088/1757-899x/1092/1/012012